EPOXY BONDED GRINDING WHEELS
GRINDING & POLISHING IN ONE PROCESS
Thanks to Epoxy bonded grinding wheels, multifaceted advantages come to the fore in order to keep up with the developing technology and production speed.
Produced with nano-tecnology plastics. It is signifcantly separated from other binding components in terms of performance and cost.
It also provides consistent shedding thanks to its nano-technology.
Compared to other binding components, the epoxy binder provides higher performance because it does not show resistance between the abrasive and the material. It gives better results in terms of time and surface quality. It works with minimal warming and material deformation thanks to its 3-dimensional microporous structure in composition.
Features; * Manufactured with special polymer Advantages; * Cool grinding performance |
ÇapxGenişlikxDelik; 125x125x95x55 |
ØxTxØHole; AW 120 H4P |
Abrasive Type |
Aluminum Oxid | A, AW, AR, ADR | Kırılgan, Yarı Kırılgan, Premium Karışık |
Silicon Carbide | CD, CG | Yarı Kırılgan, Dayanıklı | |
Ceramic | SGW, MCW | Karışık, Premium Karışık | |
Grain Size | Course - Medium - Fıne | 36, 46, 60, 80, 100, 120, 150, 180, 220 | |
Hardness | Soft - Medium | H, I, J, K, L, M, N, O, P, Q,R | |
Binding | P | Aggressive, High Chip Removal, Chip removal feature without heating |